List of supported land patterns

There are multiple standard electronic component packages that land patterns are automatically calculated for. Here we will explore specific parameters for each of them.

Parameter types

• dimension — may be set as range (involves tolerance) or as float value (tolerance implied to be zero)

  Examples:

  • 1.6
  • 0.4-0.8

• float — floating point value

  Example: 0.95

• integer — integer value

  Example: 64

Contents

• BGA (Ball Grid Array)
• CAE (Capacitor, Aluminum Electrolytic)
• CFP (Ceramic Flat Package)
• CGA (Column Grid Array)
• Chip array
• Chip
• CQFP (Ceramic Quad Flat Package)
• Crystal
• Custom
• DIP (Dual In-line Package)
• LGA (Land Grid Array)
• MELF (Metal Electrode Leadless Face)
• Molded
• Mounting hole
• Oscillator
• PAK (DPAK, D2PAK)
• QFN (Quad Flat No-lead)
• QFP (Quad Flat Package)
• Radial
• SOD (Small Outline Diode)
• SODFL (Small Outline Diode, Flat Lead)
• SOIC (Small Outline Integrated Circuit)
• SOJ (Small Outline J-lead)
• SOL (Small Outline L-lead)
• SON (Small Outline No-lead)
• SOP (Small Outline Package)
• SOT143 (Small Outline Transistor)
• SOT223 (Small Outline Transistor)
• Test point